Introduction

The FSM 500TC High-Temperature Measurement System is designed for researchers and process engineers to evaluate the thermal properties and stability of thin films in semiconductor, III-V, optoelectronics, and MEMS materials subjected to thermal cycles. This critical tool aids in identifying issues such as film cracking, voiding, and hillock formation—common challenges that can lead to reliability concerns in manufacturing. By using FSM 500TC, you can assess the maturity of new processes and materials before production deployment. The FSM 500TC’s intuitive user interface ensures ease of operation for both dedicated operators and occasional users, whether in R&D or production environments.

Key Features

• Versatility
  Accommodates 50mm to 200mm/300mm wafers without changing sample holders or jigs. Performs stress and wafer bow measurements at both room and high temperatures.
• Simple Sample Handling
  Convenient wafer placement on the heat chuck stage with location pins ensures consistent, reproducible operation.
• Auto Switching Dual Laser
  Patented dual-laser technology automatically switches wavelengths (650nm and 780nm) based on sample reflectivity, enabling measurements on diverse films, including nitrides, polyimides, low-k, high-k materials, and metals.
• Programmable Temperature Cycling
  Create recipes for single or multiple heat cycles with programmable ramp rates and annealing temperatures to evaluate thermal stability.
• Data Management & Reporting

Exportable graphs and results—such as Stress vs. Temperature, Stress vs. Time, or Wafer Bow vs. Temperature—facilitate report generation in Excel™ or Word. Standard features include Coefficient of Thermal Expansion calculations.