Metrosemi

Menu

SMART PREALIGNER

Metrosmi has a long history of developing automation designs serving the needs of the semiconductor, automotive, and medical industries. It is recognized as a leading provider of wafer automation solutions for global top tier customers in USA, Europe, and Asia. The company`s portfolio includes but it is not limited to the design and manufacturing of high technology wafer handling tools such as Equipment Front End Modules (EFEM), Wafer Handlers, Sorters, Robots, Prealigners and many more. In addition, We offers high precision CNC machining services, complex manufacturing automation solutions, and contract design services. Metrosemi long-standing experience in robotics and mechatronics can satisfy any customer requirement for production automation. What stands as a competitive advantage for Milara is the vertically integrated production system which ensures tightly controlled production processes and uncompromised final product quality. Our team of skilled professionals is dedicated to delivering products and services which exceed clients` expectations. Metrosemi’s core values of determination, commitment, production quality, customer satisfaction, continuous improvement, and teamwork are the main engine of the company`s operations.

General Specification

  • Wafer Size:150, 200, 300mm, or bridge Notched or flatted.
  • Material: Opaque Translucent Transparent
  • Thickness: 50μm~1800μm
  • Warpage: less than 8mm
  • Wafer Id:Top, bottom or random
  • Contact: Back side or edge contact
  • Carrier: FOUP, SMIF or Cassette
  • Robot:JEL or compatible
  • End Effector: Quartet Mechanics
  • Aligner: Quartet Mechanics
  • Wafer Id Reader: IOSS WID120
  • LoadPort: Hirata or compatible
  • Tool or Fab host communication: via SECS/GEM or TCP/IP
  • Software: Standard operation software with GUI
  • Function: Align and capture wafer ID, transfer wafer between carriers or to/from process module, optional flipping

Features

  • Specializes in fragile wafer transfer: ultra-thin, Taiko, ultra-thick, warped, perforated and compound wafers (e.g. SiC)
  • One machine can transfer 6”~12” multi-size and multi-type wafers
  • Options: top-pick, flip, high precision, non-con- tact, Bernoulli thin wafer transfer
  • Can mix and match FOUP, SMIF and Cassette
  • Proprietary intelligent grippers and wafer align- ers for easy customization