INTELLIGENT ROBOT & END EFFECTOR
Traditional pneumo actuated edge grippers, while able to handle wafers with diameter deviations (e.g. 300mm ±2mm), might result in wafer damage due to overstress or unsecured holding. Quartet Mechanics SoftTouch mechanism with programmable gripping force enables the gripping tips to gently touch (hug) wafers. Wafers are held with the programmed constant gripping force. With its closed loop force-feedback, the mechanism prevents wafer stress while holding the wafer gently and securely.
General Specification
- Wafer Size:150, 200, 300mm, or bridge Notched or flatted.
- Material: Opaque Translucent Transparent
- Thickness: 50μm~1800μm
- Warpage: less than 8mm
- Wafer Id:Top, bottom or random
- Contact: Back side or edge contact
- Carrier: FOUP, SMIF or Cassette
- Robot:JEL or compatible
- End Effector: Quartet Mechanics
- Aligner: Quartet Mechanics
- Wafer Id Reader: IOSS WID120
- LoadPort: Hirata or compatible
- Tool or Fab host communication: via SECS/GEM or TCP/IP
- Software: Standard operation software with GUI
- Function: Align and capture wafer ID, transfer wafer between carriers or to/from process module, optional flipping
Features
- Specializes in fragile wafer transfer: ultra-thin, Taiko, ultra-thick, warped, perforated and compound wafers (e.g. SiC)
- One machine can transfer 6”~12” multi-size and multi-type wafers
- Options: top-pick, flip, high precision, non-con- tact, Bernoulli thin wafer transfer
- Can mix and match FOUP, SMIF and Cassette
- Proprietary intelligent grippers and wafer align- ers for easy customization
