FSM 128L Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading.
FSM 500TC Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films during thermal cycling up to 500 degrees C in inert gas.
FSM 900TC Rapid Thermal Mechanical Characterization of novel materials. Simultaneous extraction of stress hysteresis, thermal desorption during thermal cycling up to 900C.
