BAWL-12 Wafer Inspection System
Precision. Efficiency. Reliability.
The BAWL-12 Wafer Inspection System is your ultimate solution for advanced semiconductor wafer inspection. With fully automated wafer handling, high-definition optical imaging, and cutting-edge analysis capabilities, the BAWL-12 series sets a new benchmark in wafer defect detection and process optimization.
Key Features
- EFEM System: Smart Wafer Handling
- Automated loading and unloading with precision mechanical arms.
- Compatible with FOUP, FOSB, Smif Pod, and Open Cassettes.
- Advanced barcode scanning and RFID for seamless wafer identification.
- High-Precision Mapping
- Layer-by-layer scanning for accurate wafer position tracking.
- Detects tilted or misaligned wafers with 100% accuracy.
- Instant alarms for abnormal conditions.
- Non-Contact Wafer Pre-Alignment
- Optical system for precise center and notch/flat location.
- Efficient, automated mechanism for fast, accurate positioning.
- Supports various materials: Si, SiC, EMC, Glass, and more.
- 360° Macro Inspection
- Full-surface inspection including front, back, and edges.
- Multi-angle viewing via a responsive control lever.
- Customizable LED lighting options: white, yellow, and green.
- Ultra-Wide Micro Inspection
- 25mm ultra-wide field of view for detailed imaging.
- High-resolution imaging with polarization and DIC contrast.
- Electric Precision Control
- Electrically controlled objective and diaphragm for optimal accuracy.
- Front-panel controls for ergonomic operation.
- APO Objectives with Long Working Distance
- High-transmittance lenses with superior color correction.
- Non-destructive testing for multiple observation modes (bright field, dark field, polarization, DIC).
- Advanced Image Analysis Software
- Automatic image stitching, depth fusion, and 3D measurement.
- Features auto-focus, particle counting, and real-time visualization.
- Compatible with 64-bit Windows systems.
- SECS/GEM Data Communication
- Seamless integration with MES systems for real-time monitoring.
- Wafer OCR for process tracking with unique wafer IDs.
- Power-outage protection ensures data integrity.
- Reliable & Safe Design
- High operational stability and transmission rates.
- Built-in UPS, vacuum holding system, and safety interlocks.
- Complies with SEMI industry standards.
Technical Performance
Parameter | Specification |
Operating Time | >95% |
Chip Rate | 1/100000 |
Maintenance Time | ≤4 hours |
Mean Time Between Errors | ≥240 hours |
System Specifications
Feature | BAWL-12 MS | BAWL-12 AS | BAWL-12 RAS |
Wafer Size | 200mm/300mm | 200mm/300mm | 200mm/300mm |
Wafer Thickness | 250-1000um | 250-1000um | 300-1000um |
Loadport | 1 | 1 or 2 | 1 or 2 |
Wafer Pre-Alignment | Non-contact | Non-contact | Non-contact |
Macro Inspection | ✓ | ✓ | ✓ |
Micro Inspection | ✓ | ✓ | ✓ |
Image Analysis Software | Optional | Optional | ✓ |
SECS/GEM Protocol | Optional | Optional | ✓ |
Wafer Review System | – | Optional | ✓ |
Power Requirements:
- 220V, 50Hz, 16A (MS/AS) | 220V, 50Hz, 32A (RAS)
- CDA: 0.4–0.6 MPa | VAC: -70 to -90 kPa
Dimensions:
- 1-Port: 2400mm (W) × 1400mm (D) × 2350mm (H)
- 2-Port: 2400mm (W) × 2050mm (D) × 2350mm (H)
Additional Features:
- High-eyepoint wide-field eyepiece with micrometer.
- Adjustable trinocular head (5–35°) for user comfort.
- Manual or automatic focusing with real-time adjustments.
- Optional accessories: filters, polarizers, DIC kits, and professional inspection software.
Dimension
Why Choose the BAWL-12 Series?
- High Accuracy: Non-contact optical precision for reliable results.
- Enhanced Productivity: Automated processes reduce manual workload.
- Versatile Compatibility: Supports various wafer types and materials.
- Future-Ready Design: Scalable options to meet evolving industry demands.
BAWL-12: Precision You Can See, Performance You Can Trust.